DESCRIPTION

ATECH LEP106 is a modified liquid bisphenol F epoxy resin with high purity and low viscosity. Compared with general bisphenol F epoxy resin, ATECH LEP106 has the advantages of lower viscosity, high purity, high epoxy value, low volatile matter, low halogen content, high temperature resistance, good water resistance and electrical performance, and good storage stability.

APPLICATION

-Aviation grade composite

-Epoxy adhesive for electronic industry

-Resin used as conductive adhesive and semiconductor packaging material

-Curing and toughening properties are similar to those of ordinary bisphenol F epoxy resin

PHYSICAL AND CHEMICAL PROPERTIES

Items	Method	Unit	Value
Appearance	Visual	–	Colorless to yellow transparent liquid
Viscosity（50±1℃），	GB/T 2794-2013	mPa•s	900～1500
EEW	GB/T 4612-2008	Eq/100g	0.58～0.61
Non-Volatile	GB/T 2793-95	%	≥99
Chlorinity Conten	GB/T 4618.3-2008	ppm	≤700